? 2004 ixys all rights reserved symbol test conditions maximum ratings v dss t j = 25 c to 150 c 500 v v dgr t j = 25 c to 150 c; r gs = 1 m ? 500 v v gs continuous 30 v v gsm transient 40 v i d25 t c = 25 c66a i dm t c = 25 c, pulse width limited by t jm 264 a i ar t c = 25 c66a e ar t c = 25 c75mj e as t c = 25 c 4.0 j dv/dt i s i dm , di/dt 100 a/ s, v dd v dss , 20 v/ns t j 150 c, r g = 2 ? p d t c = 25 c 735 w t j -55 ... +150 c t jm 150 c t stg -55 ... +150 c t l 1.6 mm (0.063 in) from case for 10 s 300 c m d mounting torque to-264 0.9/6 nm/lb.in. weight plus-247 6 g to-264 10 g hiperfet tm power mosfets q-class n-channel enhancement mode avalanche rated, high dv/dt, low q g low intrinsic r g , low t rr features z double metal process for low gate resistance z international standard packages z epoxy meet ul 94 v-0, flammability classification z avalanche energy and current rated z fast intrinsic rectifier advantages z easy to mount z space savings z high power density symbol test conditions characteristic values (t j = 25 c, unless otherwise specified) min. typ. max. v dss v gs = 0 v, i d = 3ma 500 v v gs(th) v ds = v gs , i d = 8 ma 2.0 4.5 v i gss v gs = 30 v dc , v ds = 0 200 na i dss v ds = v dss t j = 25 c50 a v gs = 0 v t j = 125 c2ma r ds(on) v gs = 10 v, i d = 0.5 ? i d25 80 m ? pulse test, t 300 s, duty cycle d 2 % g = gate d = drain s = source tab = drain ds98983a(7/04) to-264 aa (ixfk) s g d d (tab) v dss = 500 v i d25 = 66 a r ds(on) = 80 m ? ? ? ? ? t rr 250 ns ixfk 66n50q2 ixfx 66n50q2 plus 247 tm (ixfx) g d d (tab) preliminary data sheet
ixys reserves the right to change limits, test conditions, and dimensions. symbol test conditions characteristic values (t j = 25 c, unless otherwise specified) min. typ. max. g fs v ds = 10 v; i d = 0.5 ? i d25 , pulse test 30 44 s c iss 8400 pf c oss v gs = 0 v, v ds = 25 v, f = 1 mhz 1290 pf c rss 310 pf t d(on) 32 ns t r v gs = 10 v, v ds = 0.5 ? v dss , i d = 0.5 ? i d25 16 ns t d(off) r g = 1.0 ? (external), 60 ns t f 10 ns q g(on) 200 nc q gs v gs = 10 v, v ds = 0.5 ? v dss , i d = 0.5 ? i d25 47 nc q gd 98 nc r thjc 0.17 k/w r thck to-264 0.15 k/w source-drain diode characteristic values (t j = 25 c, unless otherwise specified) symbol test conditions min. typ. max. i s v gs = 0 v 66 a i sm repetitive; pulse width limited by t jm 264 a v sd i f = i s , v gs = 0 v, 1.5 v pulse test, t 300 s, duty cycle d 2 % t rr 250 ns q rm 1 c i rm 1 0 a i f = 25a, -di/dt = 100 a/ s, v r = 100 v to-264 aa outline millimeter inches min. max. min. max. a 4.82 5.13 .190 .202 a1 2.54 2.89 .100 .114 a2 2.00 2.10 .079 .083 b 1.12 1.42 .044 .056 b1 2.39 2.69 .094 .106 b2 2.90 3.09 .114 .122 c 0.53 0.83 .021 .033 d 25.91 26.16 1.020 1.030 e 19.81 19.96 .780 .786 e 5.46 bsc .215 bsc j 0.00 0.25 .000 .010 k 0.00 0.25 .000 .010 l 20.32 20.83 .800 .820 l1 2.29 2.59 .090 .102 p 3.17 3.66 .125 .144 q 6.07 6.27 .239 .247 q1 8.38 8.69 .330 .342 r 3.81 4.32 .150 .170 r1 1.78 2.29 .070 .090 s 6.04 6.30 .238 .248 t 1.57 1.83 .062 .072 dim. ixfk 66n50q2 ixfx 66n50q2 dim. mi llimeter inches min. max. min. max. a 4.83 5.21 .190 .205 a 1 2.29 2.54 .090 .100 a 2 1.91 2.16 .075 .085 b 1.14 1.40 .045 .055 b 1 1.91 2.13 .075 .084 b 2 2.92 3.12 .115 .123 c 0.61 0.80 .024 .031 d 20.80 21.34 .819 .840 e 15.75 16.13 .620 .635 e 5.45 bsc .215 bsc l 19.81 20.32 .780 .800 l1 3.81 4.32 .150 .170 q 5.59 6.20 .220 0.244 r 4.32 4.83 .170 .190 terminals: 1 - gate 2 - drain (collector) 3 - source (emitter) 4 - drain (collector) plus 247 tm outline ixys mosfets and igbts are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 b1 6,683,344 6,727,585 one or moreof the following u.s. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 b1 6,534,343 6,710,405b2 6,759,692 4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 b1 6,583,505 6,710,463
? 2004 ixys all rights reserved ixfk 66n50q2 ixfx 66n50q2 fig. 2. extended output characteristics @ 25 o c 0 20 40 60 80 100 120 140 160 02468101214161820 v d s - volts i d - amperes v gs = 10v 9v 8v 7v 6v 5v fig. 3. output characteristics @ 125 o c 0 10 20 30 40 50 60 70 0 2 4 6 8 101214 v d s - volts i d - amperes v gs = 10v 8v 7v 5v 6v 3.5v 4.5v 5.5v fig. 1. output characteristics @ 25 o c 0 10 20 30 40 50 60 70 01234567 v d s - volts i d - amperes v gs = 10v 8v 7v 5v 6v 5.5v 4.5v fig. 4. r ds(on ) norm alized to 0.5 i d25 value vs. junction temperature 0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8 3.1 -50 -25 0 25 50 75 100 125 150 t j - degrees centigrade r d s ( o n ) - normalize d i d = 66a i d = 33a v gs = 10v fig. 6. drain current vs. case temperature 0 10 20 30 40 50 60 70 -50-25 0 255075100125150 t c - degrees centigrade i d - amperes fig. 5. r ds(on) norm alized to 0.5 i d25 value vs. i d 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 0 20406080100120140160 i d - amperes r d s ( o n ) - normalize d t j = 125oc t j = 25oc v gs = 10v
ixys reserves the right to change limits, test conditions, and dimensions. ixfk 66n50q2 ixfx 66n50q2 fig. 11. capacitance 100 1000 10000 0 5 10 15 20 25 30 35 40 v d s - volts capacitance - picofarads c iss c oss c rss f = 1mhz fig. 10. gate charge 0 1 2 3 4 5 6 7 8 9 10 0 20 40 60 80 100 120 140 160 180 200 q g - nanocoulombs v g s - volts v ds = 250v i d = 33a i g = 10ma fig. 7. input admittance 0 10 20 30 40 50 60 70 80 90 100 3 3.5 4 4.5 5 5.5 6 6.5 7 v g s - volts i d - amperes t j = 125oc 25oc -40oc fig. 8. transconductance 0 10 20 30 40 50 60 70 80 0 20406080100120 i d - amperes g f s - siemens t j = -40oc 25oc 125oc fig. 9. source current vs. source-to-drain voltage 0 20 40 60 80 100 120 140 160 180 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 v s d - volts i s - amperes t j = 125oc t j = 25oc fig. 12. forw ard-bias safe operating area 1 10 100 1000 10 100 1000 v d s - volts i d - amperes 100s 1ms dc t j = 150oc t c = 25oc r ds(on) limit 10ms 25s
? 2004 ixys all rights reserved ixfk 66n50q2 ixfx 66n50q2 fig. 13. m axim um trans ie nt the rm al re s is tance 0.00 0.01 0.10 1.00 0.1 1 10 100 1000 10000 pu ls e w id th - m illis e c o n d s r ( t h ) j c - o c / w
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